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Saturday, April 25, 2020 | History

2 edition of I-Therm "88 found in the catalog.

I-Therm "88

InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components (1st 1988 Los Angeles, Calif.)

I-Therm "88

May 11-13, 1988, The Biltmore Hotel, Los Angeles, CA

by InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components (1st 1988 Los Angeles, Calif.)

  • 147 Want to read
  • 19 Currently reading

Published by IEEE, Order from IEEE Service Center in New York, Piscataway, N.J .
Written in English

    Subjects:
  • Electronic apparatus and appliances -- Thermal properties -- Congresses.,
  • Electronic apparatus and appliances -- Design and construction -- Congresses.,
  • Heat -- Transmission -- Congresses.

  • Edition Notes

    Statementgeneral chair: Avram Bar-Cohen ... [et al.]
    ContributionsBar-Cohen, Avram, 1946-, IEEE Components, Hybrids, and Manufacturing Technology Society.
    ID Numbers
    Open LibraryOL17926914M

    The therm (symbol, thm) is a non-SI unit of heat energy equal to British thermal units (Btu).It is approximately the energy equivalent of burning cubic feet ( cubic metres) – often referred to as 1 CCF – of natural gas.. Since natural gas meters measure volume and not energy content, a therm factor is used by natural gas companies to convert the volume of gas . This is the 19th Volume in the series Memorial Tributes compiled by the National Academy of Engineering as a personal remembrance of the lives and outstanding achievements of its members and foreign associates.


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I-Therm "88 by InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components (1st 1988 Los Angeles, Calif.) Download PDF EPUB FB2

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S.M. Kuo, C.L. Tien, Heat transfer augmentation in a foam-material filled duct with discrete heat sources, I-Therm 88 book InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components. I-THERM’88,pp. 87–Cited by: 1. Bujard, Thermal conductivity of boron nitride filled epoxy resins: temperature dependence and influence of sample preparation, in: Proceedings of the InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components: I-THERM'88, IEEE,pp.

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Abstract. This lecture will explore the thermal limits in Computer Systems Cooling with the aid of a “thermal design space.” First, future trends in computer technologies are stated and thermal implications are by: 4.

Get this from a library. InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components. I-THERM ' S.M. Kuo, C.L. Tien, Heat transfer augmentation in a foam-material filled duct with discrete heat sources, Thermal Phenomena in the Fabrication and Operation of Electronic Components: I-THERM’88, Inter Society Conference, Los Angeles, CA, USA,pp.

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In: Thermal phenomena in the fabrication and operation of electronic components: I-THERM’88, InterSociety conference on,IEEE, Los Angeles, CA Google Scholar Zhou W et al () Thermal conductivity of boron nitride reinforced I-Therm 88 book by: 3.

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This chapter is aimed as a concise review, but well-focused on the potentials of what is known as “High-porosity metal foams,” and hence, the practical applications where such promising media. Abstract: Castable particulate-filled epoxy resins exhibiting excellent thermal conductivity have been prepared using hexagonal boron nitride (BN) as filter.

The thermal conductivity of BN filled epoxies is influenced by the sample preparation procedures, due to agglomeration effects of the particles in the by: column is mm x mm (approx " x ").

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A revolutionary system designed to overcome the traditional challenges of hyperthermia treatment for pain management, rehabilitation and oncology. We report on the thermal and electrical properties of hybrid epoxy composites with graphene and boron nitride fillers. The thicknesses, lateral dimensions, and aspect ratios of each filler material were intentionally selected for geometric similarity to one another, in contrast to prior studies that utilized dissimilar filler geometries to achieve a 'synergistic' by: ThermiVa is a radiofrequency (RF) energy treatment that’s commonly used for vaginal rejuvenation.

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Three-dimensional models, which considered the effect of filler geometry, filler aspect ratio, conductivity ratio of filler to matrix, and interfacial layer were used to simulate the microstructure of epoxy composites for various filler volume fractions up to 30%.Cited by: A 'read' is counted each time someone views a publication summary (such as the title, abstract, and list of authors), clicks on a figure, or views or downloads the full-text.

Part of the Springer Series in Advanced Microelectronics book series (MICROELECTR., volume 57) Abstract 3D packaging employing through-silicon vias (TSVs) to connect multiple stacked dies/chips has great potential to achieve high performance and high capacity with low cost and low energy by: 1.

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